在做完芯片的版图之后,就要考虑芯片的封装,封装则需要后端工程师提供以下信息:

1. 芯片die的面积

2.芯片的PAD分布图,也就是各个PAD 的name

3.芯片PAD的坐标位置

printf("\nBondingPadLabel()\n")
procedure(BondingPadLabel()
cvId=getEditRep(hiGetCurentWindow())
foreach(shape cvId~>shapes
while((strcmp((shape~>layerName)"PAD"==0)
printf("this is \"pad\" layer")
case(shape~>object
("rect"
urx=xCoord(upperRight(shape~>bBox))
ury=yCoord(upperRight(shape~>bBox))
ux=xCoord(lowerLeft(shape~>bBox))
uy=yCoord(lowerLeft(shape~>bBox))
coolx=(urx+llx)/2
cooly=(ury+lly)/2
printout=outfile("/padBondigCoord")
fPrintf(printout "\" %1f \ "\n" coolx)
fPrintf(printout "\" %1f \ "\n" cooly)
close(pout)
pin=infile("/padBondingCoord")
CoorStr=strcat(" " read(pin) ";" read(pin) " ")
close(pin)
dbCreateLabel((cvId list("Metal1" "drawing") coolx:cooly Coorstr
"centerLeft" "R0" "roman" 60)
)
); endcase
):end of while
); end of foreach
); end procedure
保存上面的小脚本
在cadence的CIW窗口中调用上面的脚本
load("/localhome/jzl/bondPadcool.il")
BondingPadLabel() 运行该函数

这样就会得到pad的坐标