热度 70| ||
一、会议-ISSCC,VLSI,CICC,ESSCIRC,RFIC,A-SSCC
ISSCC-IEEE International Solid-State Circuits Conference,国际固态电路会议,是世界学术界和企业界公认的集成电路设计领域最高级别会议,被认为是集成电路设计领域的“世界奥林匹克大会”。(顶会,每年仅有200篇左右)
VLSI-IEEE Symposia on VLSI Technology and Circuits,超大规模集成电路研讨会
ESSCIRC-European Solid-State Circuit Conference,欧洲固态电路会议
RFIC-IEEE Radio Frequency Integrated Circuits Symposium,射频集成电路研讨会
CICC-IEEE Custom Integrated Circuits Conference,集成电路会议
ASSCC-IEEE Asian Solid-State Circuits Conference,亚洲固态电路会议
ISCAS-IEEE International Symposium on Circuits and Systems,国际电路与系统研讨会
二、期刊-IEEE JSSC,IEEE SSCL,IEEE TCAS-I,IEEE TCAS-II,IEEE TMTT,IEEE MWCL,IEEE TVLSI,IEEE TbCAS,IEEE Sensor Journal
IEEE JSSC-IEEE Journal of Solid-State Circuits ,IEEE固态电路期刊。(顶刊 SCI 1区)
IEEE SSCL-IEEE Solid-State Circuits Letters ,18年创刊,档次很高,只收流片结果,和JSSC有相同的审稿标准,首任主编Behzad Razavi。
IEEE TCAS-I-IEEE Transactions on Circuits and Systems I(SCI 2区)
IEEE TCAS-II-IEEE Transactions on Circuits and Systems II(SCI 2区)
IEEE TMTT-IEEE Transactions on Microwave Theory and Techniques(SCI 1区)
IEEE MWCL-IEEE Microwave and Wireless Components Letters(SCI 2区)
IEEE TVLSI-IEEE Transactions on Very Large Scale Integration(SCI 2区)
IEEE TBCAS-IEEE Transactions on Biomedical Circuits and Systems(SCI 2区)
IEEE Sensor Journal-SCI期刊,中科院杂志分区工程:电子与电气分类下的 3 区期刊。