日志

RFIC top-end papers

已有 723 次阅读| 2014-11-27 17:21

RFIC top-end papers are easy to publish after researching previous papers in ISSC, JSSC,CICC, VLSI, RFIC, ESSIRC, ASSC,ISCAS, SiRF and journal and conference papers, much less room is left for descendant to dig.

In terms of the latest news that articles in ISSC 2015 show it is much tougher to publish one paper in ISSC, more experienced researchers can produce excellent fruits. After all, excellent IC designers need solid major knowledge and advanced design methodology, hard work and comparative spirit. Of course, brilliant partners or tutors will surely move you forward faster and smoother.

There is no difficulties in the world, the point is that people' commitment to their enterprise never stop, they have accumulated confidence overcoming any hardship.

In IC design realm, time is money and the life of one company, technology is the secondary than the market. one expert said accurately, no products can be undone for market.

The market competition is so harsh beyond your imagination, IC market again extends its bound with quick margin's drop in cell phone market- the largest IC market, chip for mobile platform, GPU, server will become next focus like cell phone market.

Chip for medical field and sensor, wearable devices gets more and more attention, but there is no burst-point to contribute its swift growth.

Be patient, undoubtedly chip design is not one new-start industry rather than mobile internet. the time to gain monopoly profits is much shorter, competition is much harsh.

new semiconductor process may bring some hope to shrink the gigantic complexity and cost of fabrication to revitalize the industry.