一、综合词汇

1、印制电路：printed circuit
2、印制线路：printed wiring
3、印制板：printed board
4、印制板电路：printed circuit board (PCB)
5、印制线路板：printed wiring board(PWB)
6、印制元件：printed component
7、印制接点：printed contact
8、印制板装配：printed board assembly
9、板：board
10、单面印制板：single-sided printed board(SSB)
11、双面印制板：double-sided printed board(DSB)
12、多层印制板：mulitlayer printed board(MLB)
13、多层印制电路板：mulitlayer printed circuit board
14、多层印制线路板：mulitlayer prited wiring board
15、刚性印制板：rigid printed board
16、刚性单面印制板：rigid single-sided printed borad
17、刚性双面印制板：rigid double-sided printed borad
18、刚性多层印制板：rigid multilayer printed board
19、挠性多层印制板：flexible multilayer printed board
20、挠性印制板：flexible printed board
21、挠性单面印制板：flexible single-sided printed board
22、挠性双面印制板：flexible double-sided printed board
23、挠性印制电路：flexible printed circuit (FPC)
24、挠性印制线路：flexible printed wiring
25、刚性印制板：flex-rigid printed board, rigid-flex printed board
26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、齐平印制板：flush printed board
29、金属芯印制板：metal core printed board
30、金属基印制板：metal base printed board
31、多重布线印制板：mulit-wiring printed board
32、陶瓷印制板：ceramic substrate printed board
33、导电胶印制板：electroconductive paste printed board
34、模塑电路板：molded circuit board
35、模压印制板：stamped printed wiring board
36、顺序层压多层印制板：sequentially-laminated mulitlayer
37、散线印制板：discrete wiring board
38、微线印制板：micro wire board
39、积层印制板：buile-up printed board
40、积层多层印制板：build-up mulitlayer printed board (BUM)
41、积层挠印制板：build-up flexible printed board
42、表面层合电路板：surface laminar circuit (SLC)
43、埋入凸块连印制板：B2it printed board
44、多层膜基板：multi-layered film substrate(MFS)
45、层间全内导通多层印制板：ALIVH multilayer printed board
46、载芯片板：chip on board (COB)
47、埋电阻板：buried resistance board
48、母板：mother board
49、子板：daughter board
50、背板：backplane
51、裸板：bare board
52、键盘板夹心板：copper-invar-copper board
53、动态挠性板：dynamic flex board
54、静态挠性板：static flex board
55、可断拼板：break-away planel
56、电缆：cable
57、挠性扁平电缆：flexible flat cable (FFC)
58、薄膜开关：membrane switch
59、混合电路：hybrid circuit
60、厚膜：thick film
61、厚膜电路：thick film circuit
62、薄膜：thin film
63、薄膜混合电路：thin film hybrid circuit
64、互连：interconnection
65、导线：conductor trace line
66、齐平导线：flush conductor
67、传输线：transmission line
68、跨交：crossover
69、板边插头：edge-board contact
70、增强板：stiffener
71、基底：substrate
72、基板面：real estate
73、导线面：conductor side 
74、元件面：component side
75、焊接面：solder side
76、印制：printing
77、网格：grid
78、图形：pattern
79、导电图形：conductive pattern
80、非导电图形：non-conductive pattern
81、字符：legend
82、标志：mark

二、基材：

1、基材：base material
2、层压板：laminate
3、覆金属箔基材：metal-clad bade material
4、覆铜箔层压板：copper-clad laminate (CCL)
5、单面覆铜箔层压板：single-sided copper-clad laminate
6、双面覆铜箔层压板：double-sided copper-clad laminate
7、复合层压板：composite laminate
8、薄层压板：thin laminate
9、金属芯覆铜箔层压板：metal core copper-clad laminate
10、金属基覆铜层压板：metal base copper-clad laminate
11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
12、基体材料：basis material
13、预浸材料：prepreg
14、粘结片：bonding sheet
15、预浸粘结片：preimpregnated bonding sheer
16、环氧玻璃基板：epoxy glass substrate 
17、加成法用层压板：laminate for additive process
18、预制内层覆箔板：mass lamination panel
19、内层芯板：core material
20、催化板材：catalyzed board ,coated catalyzed laminate
21、涂胶催化层压板：adhesive-coated catalyzed laminate
22、涂胶无催层压板：adhesive-coated uncatalyzed laminate
23、粘结层：bonding layer
24、粘结膜：film adhesive
25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film
26、无支撑胶粘剂膜：unsupported adhesive film
27、覆盖层：cover layer (cover lay)
28、增强板材：stiffener material
29、铜箔面：copper-clad surface
30、去铜箔面：foil removal surface
31、层压板面：unclad laminate surface
32、基膜面：base film surface
33、胶粘剂面：adhesive faec
34、原始光洁面：plate finish
35、粗面：matt finish 
36、纵向：length wise direction 
37、模向：cross wise direction 
38、剪切板：cut to size panel
39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates 
42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates
45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates
48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
49、超薄型层压板：ultra thin laminate
50、陶瓷基覆铜箔板：ceramics base copper-clad laminates
51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates

三、基材的材料

1、 A阶树脂：A-stage resin
2、 B阶树脂：B-stage resin
3、 C阶树脂：C-stage resin
4、环氧树脂：epoxy resin
5、酚醛树脂：phenolic resin
6、聚酯树脂：polyester resin
7、聚酰亚胺树脂：polyimide resin
8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin
9、丙烯酸树脂：acrylic resin
10、三聚氰胺甲醛树脂：melamine formaldehyde resin
11、多官能环氧树脂：polyfunctional epoxy resin
12、溴化环氧树脂：brominated epoxy resin
13、环氧酚醛：epoxy novolac
14、氟树脂：fluroresin
15、硅树脂：silicone resin
16、硅烷：silane
17、聚合物：polymer
18、无定形聚合物：amorphous polymer
19、结晶现象：crystalline polamer
20、双晶现象：dimorphism
21、共聚物：copolymer
22、合成树脂：synthetic
23、热固性树脂：thermosetting resin
24、热塑性树脂：thermoplastic resin
25、感光性树脂：photosensitive resin
26、环氧当量：weight per epoxy equivalent (WPE)
27、环氧值：epoxy value
28、双氰胺：dicyandiamide
29、粘结剂：binder
30、胶粘剂：adesive
31、固化剂：curing agent
32、阻燃剂：flame retardant
33、遮光剂：opaquer
34、增塑剂：plasticizers
35、不饱和聚酯：unsatuiated polyester
36、聚酯薄膜：polyester
37、聚酰亚胺薄膜：polyimide film (PI)
38、聚四氟乙烯：polytetrafluoetylene (PTFE)
39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)
40、增强材料：reinforcing material
41、玻璃纤维：glass fiber
42、 E玻璃纤维：E-glass fibre
43、 D玻璃纤维：D-glass fibre
44、 S玻璃纤维：S-glass fibre
45、玻璃布：glass fabric
46、非织布：non-woven fabric
47、玻璃纤维垫：glass mats
48、纱线：yarn
49、单丝：filament
50、绞股：strand
51、纬纱：weft yarn
52、经纱：warp yarn
53、但尼尔：denier
54、经向：warp-wise
55、纬向：weft-wise, filling-wise
56、织物经纬密度：thread count
57、织物组织：weave structure
58、平纹组织：plain structure
59、坏布：grey fabric
60、稀松织物：woven scrim
61、弓纬：bow of weave
62、断经：end missing
63、缺纬：mis-picks
64、纬斜：bias
65、折痕：crease
66、云织：waviness
67、鱼眼：fish eye
68、毛圈长：feather length
69、厚薄段：mark
70、裂缝：split
71、捻度：twist of yarn
72、浸润剂含量：size content
73、浸润剂残留量：size residue
74、处理剂含量：finish level
75、浸润剂：size
76、偶联剂：couplint agent
77、处理织物：finished fabric
78、聚酰胺纤维：polyarmide fiber
79、聚酯纤维非织布：non-woven polyester fabric
80、浸渍绝缘纵纸：impregnating insulation paper
81、聚芳酰胺纤维纸：aromatic polyamide paper
82、断裂长：breaking length
83、吸水高度：height of capillary rise
84、湿强度保留率：wet strength retention
85、白度：whitenness
86、陶瓷：ceramics
87、导电箔：conductive foil
88、铜箔：copper foil
89、电解铜箔：electrodeposited copper foil (ED copper foil)
90、压延铜箔：rolled copper foil
91、退火铜箔：annealed copper foil
92、压延退火铜箔：rolled annealed copper foil (RA copper foil)
93、薄铜箔：thin copper foil 
94、涂胶铜箔：adhesive coated foil
95、涂胶脂铜箔：resin coated copper foil (RCC)
96、复合金属箔：composite metallic material
97、载体箔：carrier foil
98、殷瓦：invar
99、箔（剖面）轮廓：foil profile
100、光面：shiny side
101、粗糙面：matte side
102、处理面：treated side
103、防锈处理：stain proofing
104、双面处理铜箔：double treated foil

四、设计

1、原理图：shematic diagram
2、逻辑图：logic diagram
3、印制线路布设：printed wire layout
4、布设总图：master drawing
5、可制造性设计：design-for-manufacturability
6、计算机辅助设计：computer-aided design.(CAD)
7、计算机辅助制造：computer-aided manufacturing.(CAM)
8、计算机集成制造：computer integrat manufacturing.(CIM)
9、计算机辅助工程：computer-aided engineering.(CAE)
10、计算机辅助测试：computer-aided test.(CAT)
11、电子设计自动化：electric design automation .(EDA)
12、工程设计自动化：engineering design automaton .(EDA2)
13、组装设计自动化：assembly aided architectural design. (AAAD)
14、计算机辅助制图：computer aided drawing
15、计算机控制显示：computer controlled display .(CCD)
16、布局：placement
17、布线：routing
18、布图设计：layout
19、重布：rerouting
20、模拟：simulation
21、逻辑模拟：logic simulation
22、电路模拟：circit simulation
23、时序模拟：timing simulation
24、模块化：modularization
25、布线完成率：layout effeciency
26、机器描述格式：machine descriptionm format .(MDF)
27、机器描述格式数据库：MDF databse
28、设计数据库：design database
29、设计原点：design origin
30、优化（设计）：optimization (design)
31、供设计优化坐标轴：predominant axis
32、表格原点：table origin
33、镜像：mirroring
34、驱动文件：drive file
35、中间文件：intermediate file
36、制造文件：manufacturing documentation
37、队列支撑数据库：queue support database
38、元件安置：component positioning
39、图形显示：graphics dispaly
40、比例因子：scaling factor
41、扫描填充：scan filling
42、矩形填充：rectangle filling
43、填充域：region filling
44、实体设计：physical design
45、逻辑设计：logic design
46、逻辑电路：logic circuit
47、层次设计：hierarchical design
48、自顶向下设计：top-down design
49、自底向上设计：bottom-up design
50、线网：net
51、数字化：digitzing
52、设计规则检查：design rule checking
53、走（布）线器：router (CAD)
54、网络表：net List
55、计算机辅助电路分析：computer-aided circuit analysis
56、子线网：subnet
57、目标函数：objective function
58、设计后处理：post design processing (PDP)
59、交互式制图设计：interactive drawing design
60、费用矩阵：cost metrix
61、工程图：engineering drawing
62、方块框图：block diagram
63、迷宫：moze
64、元件密度：component density
65、巡回售货员问题：traveling salesman problem
66、自由度：degrees freedom
67、入度：out going degree
68、出度：incoming degree
69、曼哈顿距离：manhatton distance
70、欧几里德距离：euclidean distance
71、网络：network
72、阵列：array
73、段：segment
74、逻辑：logic
75、逻辑设计自动化：logic design automation 
76、分线：separated time
77、分层：separated layer
78、定顺序：definite sequence

五、形状与尺寸：

1、导线（通道）：conduction (track)
2、导线（体）宽度：conductor width
3、导线距离：conductor spacing
4、导线层：conductor layer
5、导线宽度/间距：conductor line/space
6、第一导线层：conductor layer No.1
7、圆形盘：round pad
8、方形盘：square pad
9、菱形盘：diamond pad
10、长方形焊盘：oblong pad
11、子弹形盘：bullet pad
12、泪滴盘：teardrop pad
13、雪人盘：snowman pad
14、 V形盘：V-shaped pad
15、环形盘：annular pad
16、非圆形盘：non-circular pad
17、隔离盘：isolation pad
18、非功能连接盘：monfunctional pad
19、偏置连接盘：offset land
20、腹（背）裸盘：back-bard land
21、盘址：anchoring spaur
22、连接盘图形：land pattern
23、连接盘网格阵列：land grid array
24、孔环：annular ring
25、元件孔：component hole
26、安装孔：mounting hole
27、支撑孔：supported hole
28、非支撑孔：unsupported hole
29、导通孔：via
30、镀通孔：plated through hole (PTH)
31、余隙孔：access hole
32、盲孔：blind via (hole)
33、埋孔：buried via hole
34、埋/盲孔：buried /blind via
35、任意层内部导通孔：any layer inner via hole (ALIVH)
36、全部钻孔：all drilled hole
37、定位孔：toaling hole
38、无连接盘孔：landless hole
39、中间孔：interstitial hole
40、无连接盘导通孔：landless via hole
41、引导孔：pilot hole
42、端接全隙孔：terminal clearomee hole
43、准表面间镀覆孔：quasi-interfacing plated-through hole
44、准尺寸孔：dimensioned hole
45、在连接盘中导通孔：via-in-pad
46、孔位：hole location
47、孔密度：hole density
48、孔图：hole pattern
49、钻孔图：drill drawing
50、装配图：assembly drawing
51、印制板组装图：printed board assembly drawing
52、参考基准：datum referance
54、基准尺寸：reference dimension
55、参考尺寸：reaerence dimension
56、直接量定尺寸：direct dimensioning
57、基准图：datum feature
58、基准边：reference edge
59、导线设计距离：design space of conductor
60、导线设计宽度：design width of conductor
61、中心距：center to center spacing
62、线宽/间距：conductor width/space
63、节距：pitch
64、精细节距：fine pitch
65、层：layer
66、层间距：layer-to-layer spacing
67、边距：edge spacing
68、外形线：trim line
69、截面积：crossection area
70、真实值表测量：truth table test
71、准确位置：true position tolerance
72、精确位置：accuracy
73、精确位置误差：cumulative tolerance
74、精确度：accuracy
75、累积误差：cumulative tolerance
76、焊垫：footprint
77、外层：external layer
78、内层：internal layer
79、接地层：ground plane
80、接地层隔离：ground plane clearance
81、电压层：voltage plane
82、电源层隔离：voltage plane clearance
83、电源层：power plane, bus plane 
84、导通网络：basic grid
85、导通网格：track grid
86、导通孔网格：via grid
87、连通盘网格：pad (land) grid
88、定位偏差：positional tolerance
89、对准靶标：bornb sight
90、梳状图形：comb pattern
91、对准标记：register mark
92、散热层：heat sink plane

六、电气互连

1、表面间连接：interlayer connection
2、层间连接：interlayer connection
3、内层连接：innerlayer connection
4、非功能表面连接：nonfunctional interfacial connection
5、跨接线：jumper wire
6、节（交）点：node
7、附加线：haywire
8、端接（点）：terminal
9、连接线：terminated line
10、端接：termination
11、连接端：pad, land
12、贯穿连接：through connection
13、支线：stub
14、印制插头：tab
15、键槽：keying slot
16、连接器：connector
17、板边连接器：edge board connector
18、连接器区：connector area
19、直角板边连接器：right angle edge connector
20、偏槽口：polarizing slot
21、偏置端接区：offset terminal area
22、接地：ground
23、端接隔离（空环）：terminal clearance
24、连通性：continuity
25、连接器接触：connector contact
26、接触面积：contact area
27、接触间距：contact spacing
28、接触电阻：contact resistance
29、接触尺寸：contact size
30、元件引腿（脚）：component lead
31、元件插针：component pin
32、最小电气间距：minimum electrical spacing
33、导电性：conductivity 
34、边卡连接器：card-edge connector
35、插卡连接器：card-insertion connector
36、载流量：current-carrying capacity
37、蹯径：path
38、最短路径：shortest path
39、关键路径：critical path
40、倒角：miter
41、串推：daisy chain
42、斯坦纳树：steiner tree
43、最小生成树：minimum spanning tree (MST)
44、瓶颈宽度：necked width
45、短叉长度：spur length
46、短柱长度：stub length
47、曼哈顿路径：manhattan path
48、连接度（性）：connectivity

七、其它

1、主面：primary side 
2、辅面：secondary side
3、支撑面：supporting plane
4、信号：signal 
5、信号导线：signal conductor
6、信号地线：signal ground
7、信号速率：signal rate
8、信号标准化：signal standardization
9、信号层：signal layer
10、寄生信号：spurious signal 
11、串扰：crosstalk
12、电容：capacitance
13、电容耦合：capacitive coupling
14、电磁干扰：electromagnetic interference
15、电磁屏蔽：electromangetic shielding
16、噪音：noise
17、电磁兼容性：electromagnetic compatbility
18、特性阻抗：impedance
19、阻抗匹配：impedance match
20、电感：inductance
21、延迟：delay 
22、微带线：microstrip
23、带状线：stripline
24、探测点：probe point
25、开窗口：cross hatching
26、跨距：span
27、共面性（度）：coplanarity
28、埋入电阻：buried resistance 
29、黄金板：golden board
30、芯板：core board
31、薄基芯：thin core
32、非均衡传输线：unbalanced transmission line
33、阀值：threshold
34、极限值：threshold limit value(TLV)
35、散热层：heat sink plane
36、热隔离：heat sink plane
37、导通孔堵塞：via filiing
38、波动：surge
39、卡板：card
40、卡板盒/卡板柜：card cages/card racks
41、薄型多层板：thin type multilayer board
42、埋/盲孔多层板：
43、模块：module
44、单芯片模块：single chip module (SCM)
45、多芯片模块：multichip module (MCM)
46、多芯片模块层压基板：laminate substrate version of multichip module (MCM-L)
47、多芯片模块陶瓷基数板：ceramic substrate version o fmultichip module (MCM-C)
48、多芯片模块薄膜基板：deposition thin film substrate version of multilayer module (MCM-D)
49、嵌入凸块互连技术：buried bump interconnection technology (B2 it)
50、自动测试技术：automatic test equipment (ATE)
51、芯板导通孔堵塞：core board viafilling
52、对准标记：alignment mark
53、基准标记：fiducial mark
54、拐角标记：corner mark
55、剪切标记：crop mark
56、铣切标记：routing mark
57、对位标记：registration mark
58、缩减标记：reduvtion mark
59、层间重合度：layer to layer registration
60、狗骨结构：dog hone
61、热设计：thermal design
62、热阻：thermal resistance